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The Preparation And Application Of Fast-curing Epoxy Cover-layer For Flexible Printed Circuits

Posted on:2014-11-30Degree:MasterType:Thesis
Country:ChinaCandidate:D J LiuFull Text:PDF
GTID:2251330401477153Subject:Polymer Chemistry and Physics
Abstract/Summary:PDF Full Text Request
In order to prepare the fast curing epoxy adhesive, the core of this paper is to study thehighly reactive epoxy and the compounded curing agents and accelerator.The high-activity reactive epoxy could be fast-cured by curing agent,it curing faster thanbisphenol A epoxy resins several times, or10times. The high-activity reactive epoxy resincould viscosity at room temperature for a long period,heat resistanceexcellent and adhesiveproperties,. The highly reactive epoxy resin was mixed with epoxy resin in the paper, thebest ratio of mixed epoxy epoxy is TDE-85: AG-80: CYD-128=5:5:90Compounded curing agent is the key compounded of the fast curing adhesive,anddetermines the structure and performance of the adhesive. In this paper, A low molecularweight polyamides was prepared. In order to overcome the performance of a single curingagent less singer,all of this modified curing agent are mixed to obtain the compoundedcuring agent. The analysis of the performance of the adhesive properties and thecompounded curing agent have shown that the compounded curing can be effectivefast-curing adhesive performance in the heating conditions.Latent accelerator is mixed with the agent, the epoxy adhesive have a good storageperiod at low temperatures and the speed of curing faster at high temperatures. The impact ofdifferent enhancers was discussed in this paper. The boron trifluoride ethylamine wasselected as the accelerator on the overall performance of the adhesive. When the ddingamount of curing accelerator particles is one share, the fast curing epoxy adhesive has a goodperformance.The fast curing epoxy adhesive formulations was get by the designed formulas with thecompound curing agent. The impact of various factors on the rapid adhesive propertieswas studied in the analysis of the adhesive comprehensive experiment.The FPC epoxy covering film was made by the fast-curing epoxy adhesive,thepolyimide film, copper foil was choosed to test its heat resistance, the amount of the excessglue and electrical properties. The available performance comparison was prepared on FPCcovering film and commercially covering filmThe results has showned that the cover film of the laboratory to get the best recipeperformance and best prepared by a cover film performance, the film of performance ishigher than the national standards. The film can meet the requirement of production of FPC.Compared with the commercially film, the cover filmof made in the laboratory are higherpeel strength, the amount of excess glue and the dimensional stability than the commerciallyavailable cover film.
Keywords/Search Tags:Fast-curing, The high-activity reactive epoxy, Latent accelerator, Compounded curing agent, FPC(Flexible Printed Circuit)
PDF Full Text Request
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