Study And Application Of Stretchable And Foldable Of Ultra-thinsingle Crystalline Silicon

With the development of the science and technology, the demand forsilicon feature sizes in MEMS applications is growing. This paper first analyzes thevarious properties of single crystal silicon, silicon wafer preparation and wafer thinningtechnology, and silicon micromachining method. We found that when the single crystalsilicon is thinned to micron, it does not perform macro performance of rigidity andbrittleness any more. On the contrary it performs scalability and foldability. This paperanalyzes the scalability and foldability of ultra-thin silicon monocrystalline boththeoretically and experimentally. When supported by an elastic substrate PDMS, the“wave” single crystal silicon can be reversibly stretched and compressed under largestrain level and the silicon will not be damaged. The wavelength and the amplitude ofthe wave change periodically to adapt to the deformation.An important application of single crystal silicon scalability and foldability isMEMS micro deformable mirror. MEMS micro deformable mirror can be used as thewave-front corrector of an adaptive optical system. Adaptive optics system is mainlycomposed of three parts, the wave-front sensor, the wave front controller and thedeformable mirror. Based on the research status and problems of the micro deformablemirror, this paper focuses on eletrostatic actuated continuous surface deformable mirror,and theoretically analyzes the static and dynamic response of the deformable mirror indepth. In order to explore the influence of different electrode numbers, electrode array,and the silicon film thickness and size on the deformation properties of the microdeformable mirror,88，1616，3232drive electrode arrays are designed andfabricated, and a valid method for testing the relation of the deformation of theultra-thin silicon deformation mirror and driving voltage is established.