Laminated Chip Power Inductor Design And Production Technology

With the development of IT,electronic components continue to be the developmentdirection of the chip, miniaturization, high-frequency, high-performance and low powerconsumption.Multilayer chip inductors as one of the inductor chip and theminiaturization of the product,development in recent years rapidly,has developed amultilayer chip ferrite inductor, multilayer chip inductors, multilayer chip beads threecategories.Multilayer chip high-power beads as a representative of the development oflow-power multilayer chip inductors,is a mature application.Its main characteristic islow DC resistance, high rated current.The rated current up to six times more than thegeneric multilayer chip beads.ultilayer chip high-power bead is mainly used in thepower part of the electromagnetic interference (Electromagnetic Interference EMI)suppression abbreviation.Multilayer chip ferrite inductors, low-power development isrelatively slow.It is mainly due to the soft ferrite materials and the constraints of theinductor structure.This regard the country is nearly seven years backward foreign,especially Japanese companies as the representative.Multilayer chip high-power inductors belong to a kind of multilayer chipinductors,has low power high rated current consumption.The general definition of therated current of the multilayer chip high-power inductors to meet the inductortemperature does not exceed40℃and inductance decrease superimposed on not morethan30%of the inductor DC current. This paper studies the design, manufacture andreliability.(1) Studied the structure, materials and reliability design. When the non-magneticbarrier layer is set in the middle of the coil, the inductance of the decline in thesuperimposed DC current is the smallest. High power soft ferrite should have asaturation magnetic flux density, magnetic coercivity, grain size smaller features.Reducing the DC resistance and temperature rise is critical of the reliability design ofmultilayer chip power inductors.(2) Focus on the three different molding process, which cast perforation andchemical through-hole method is more suitable for multilayer chip power inductors developed.(3) Studied the testing and reliability. The main failure mode is open circuit, shortcircuit, the electrical parameter drift and weld. These failures occurred mainly due toimproper process control or process conditions deviate from. Life test of the reliabilitytest, the magnitude of the electrical performance parameters change is the biggest.In recent years, Japanese manufacturers to develop smaller multilayer chiphigh-power inductors,such as1.6mm×0.8mm,has market,and welcomed by themarket.Therefore, the miniaturization of the multilayer chip power inductors willcontinue to develop an important direction.