Design Of The Radiators For High Power LED Lamps

The heat issue of high-power LED lamp is one of the bottle-neckproblems that hinder its development. To solve this problem, a new packagestructure and a composite radiator is proposed in this paper. The character ofthe radiator includes metal and polymer. The metal has high heattransfer efficiency and the polymer which is easy to make micro structure onthe surface, and lead to large cooling areas. The main content of this paper isgiven as follows:1. A radiator for high-power LED bulb is designed, and the optimizedstructure is obtained by numerical simulations. And a new type of packagestructure with LED chips and the radiator is designed which combines metaland thermal polymer. Thereby the contact resistance of chip and radiator shellis reduced.2. A radiator made of polymer for integrated high-power LED streetlamps is designed, and the general laws between single factor and the coolingperformance of the radiator are acquired. The factors include the fin height, finlength and fin thickness. And the multi-factors are studied by using orthogonalexperiment method to optimize the structure. The results of numericalsimulations show that the radiator designed meets the cooling requirements of 100W LED street lamp, and it is lightweight, corrosion-resistant and lwo cost.3. A polymer micro channel plate radiator is designed for high-powerelectronic devices. The width of the micro-channel is0.3mm which increasesthe cooling area of the radiator. The optimized structure is obtained byanalyzing the factors affecting the thermal performance. The test samples aremade by polymer micro-injection molding.4. An experiment system is designed. The functions include theprogrammable control of LED chips, providing of continuous cooling mediumfor the exchanger as while as the measurement and storage of the needed data.The micro-channel heat radiator is tested with this experiment system, theresults show that the radiator has a good thermal performance.The innovations of this paper are:1. Anew light package structure is proposed in this paper, the connectionof the chip cornerstone and the radiator shell reduces the contact resistanceeffectively.2. A metal-polymer composite micro-channel radiator is proposed.The micro channels on the surface increase the heat transfer areas and themetal improves the heat conduction rate.