Research On Dynamic Simulation Of Cleaning System In Large-sized Silicon Ultra-precision Grinding Machine And Experiment

With the development of integrated circuit manufacturing technology, the diameter of itsmain substrate material silicon wafer is increasing continuously, the traditionalsilicon-processing methods are challenged by many new problems, the most urgent one is thatthe yield and reliability is not easy to guarantee due to cleanliness-inadequate of wafer surfacesince the processing of wafer is more difficult as its size increasing, due to lack of cleanlinessof silicon surface, the silicon yield and reliability is not easy to guarantee. Therefore it isnecessary to carry out the research of large-size wafer ultra-precision grinding machine and itskey technologies, the dynamic simulation technology of cleaning system is one of them.Production practice shows that the wafer finished surface quality and processing efficiencyare heavy influenced by wafer cleaning process. Thus, the study on optimization oflarge-sized silicon ultra-precision grinding machine cleaning process plays an important rollin development and research of high precision, quality and efficiency of large-sized waferultra-precision processing equipment with independent intellectual property rights, and it hasimportant theoretical significance and practical value as well.In this paper, by contrasting of effect on cleaning performance of cleaning equipmentand liquid in silicon production, the spray-after-rotation cleaning equipment and deionizedwater mixture cleaning liquid are adopted. this solution can be achieved with a simplestructure, low cost, and it can be operated easily but the cleaning performance is brilliant andits process is environmental. By the contrasting test of cleaning process parameters indifferent groups, the affection of wafer surface flatness and cleanliness under differentparameters are obvious and wafer-cleaning brush speed, wafer-rotation speed and the sprayspeed of cleaning liquid are finally decided; by dynamic simulation of process of cleaningsystem in the prototype, the beats in cleaning process get optimized, the coordinated operationof the cleaning process with the silicon transport and grinding process can be achieved.In this paper, the cleaning process parameters are optimized by contrasting brigadelaboratory method, a set of cleaning process parameters can be achieved without decreasingthe precision of silicon surface eventually, the cleanliness of silicon wafer surface which isprocessed under these parameters can meet the application standard of the silicon wafermarket, the similar foreign products can be substituted accordingly.