Preparation And Surface Tension Determination Of Line-Cutting Basefluid Based On PEG200

In this dissertation, a research has been made on the surface tension performance of the the wire-cutting liquid, which is widely used in the semiconductor industry and photovoltaic industry.In this paper, we have developed a new method of surface tension mesurement based on the national standard:drop volume method. The new method has many achivements, including simple equipment, low cost, small sample volume, and accurate results.We used the PEG200as matrix, in which we added some different types and amounts of surfactant and defoamer, then measured their surface tension. The improved drop volume method was used to determine, and compare with the commercially product wire-cutting liquid. So we can find a more effective formula and ratio of the surfactant and defoamer. When adding surfactant alone, if we want to reduce the surface tension of PEG200to35mN/m, the adding capacity is generally need10%or more. And when adding surfactant alone, the system was very easy to foaming, In order to defoam. we added a small amount of defoamer again. After that the same effect of reducing the surface tension was achieved, and the total amount could reduce to3%or less, far less than10%when adding alone.