High-speed Lapping Mechanism Of CVD Diamond Film

Chemical vapor deposition(CVD) diamond film is widely used in electronic,optical industry, mechanical, aerospace and other fields due to its excellent physicaland chemical properties of the highest hardness, low friction coefficient, high thermalconductivity, good anticorruptibility and chemical stability. However, in the depositionprocess of the chemical vapor deposition(CVD) diamond film, polycrystalline CVDdiamond films have surface roughness, particle size and non-uniform thickness whichcan adversely affect their application. Furthermore, it is necessary to process thefurther research, then make it satisfy all aspects of application requirement.The traditional mechanical grinding methods commonly used polishing abrasivematerials placed on the polishing disk for slow grinding. This kind of grinding methodsexist the problem of low efficiency and time-consuming in lapping. In this paper, thesubject of high-speed lapping of CVD diamond film was proposed, which is in theview of the existence problem. The grinding speed increased to30~50m/s or so, witha solid abrasive (resin-bonded diamond wheel) for grinding. The advantage of thediamond wheel is high grinding efficiency, good quality, and without flying grit. Themethod makes further improvement of grinding CVD diamond film. Based ontheoretical analysis and experimental, this paper studies the poshing mechanism ofmechanical polishing CVD diamond film in the high-speed with bond diamond wheel.The major research work is included as follows：By using ANSYS software, firstly, the material model of the resin-bondeddiamond wheel′s working layer was established. The variation of diamond wheel′selastic modulus and poisson’s ratio according to the wheel′s concentration and particlesize was analyzed and calculated, which layed the foundation for the temperature field.Secondly, According to the grinding device, the finite element model of lapping usingdiamond grinding wheel was established. And the distribution and change of CVD diamond film lapping surface′s temperature field were simulated and analyzed throughapplying the corresponding wheel speed, load pressure on the model, diameter size ofdiamond film and the way of movement.The results provided a theoretical basis for theexperimental study.Experimental studies on mechanical polishing CVD diamond film in high-speedwere carried out. The primary investigation was carried out using mechanical polishingequipment for grinding. According to the lapping experiment, the impact on thematerial removal rate, surface roughness and surface morphology of CVD diamondfilm caused by the linear velocity, pressure, lapping time and so on was studied in thisexperiment. The diamond films after polishing were observed by means of scanningelectron microscope (SEM) images. The machining process and factors whichinfluence the polishing efficiency and quality were preliminary discussed.