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A Study On The Property Of Cu-Ti3SiC2Composite Materials Prepared By Different Techeniques

Posted on:2013-12-31Degree:MasterType:Thesis
Country:ChinaCandidate:W C TanFull Text:PDF
GTID:2231330374976030Subject:Materials Processing Engineering
Abstract/Summary:PDF Full Text Request
Titanium silicon carbide (Ti3SiC2) is a new class of ceramic material. Its theoreticaldensity is4.53g/cm3and melting point is3000℃. It has excellent electric and thermalconductivity which is similar to metal. Ti3SiC2has many unique properties, such ashigh temperature plasticity, excellent thermal shock, high melting point, excellent corrosionresistance, high yield strength and oxidation resistance, etc. These unique properties enable itto a wide range of future applications. In this work, we fabricated Ti3SiC2by pressurelessreactive sintering and we also studied the effect of caping and sintering atmosphere.Cu Ti3SiC2composit were prepared by adding Ti3SiC2powder of5wt%,15wt%,25wt%,35wt%into the copper powder using different forming and sintering technologies.Ti3SiC2bulks were obtained by using Ti, Si, C power as raw materials. The experimentswere done either under vacuum or argon atmosphere with different starting molar ratio.Results show that caping do have effect on the purity of Ti3SiC2. The better the caping is, theless the amount of the impurities is. The purities of Ti3SiC2were also affected when sinteredunder different sintering atmosphere.It turns out that the purities of Ti3SiC2will get a betterresult when sintered under vacuum atmosphere. In terms of the volatility of silicon, we canget pure Ti3SiC2when sintered in a caping device under vacuum by using a ratio of3Ti:1.2Si:1.8C.By pressureless sintering, experimental results show that the density of the Cu Ti3SiC2composites decreases, resistivity, and the hardness is increased first and then decreased withthe increase of the Ti3SiC2content. The relative density of the composite prepared by thismethod is low. The relative density is93.4%when the content of Ti3SiC2is5wt%. It is71.6%when the content of Ti3SiC2is35%, which contains high porosity. Its comprehensiveperformance declined when the added Ti3SiC2content is high, so the process is not suitablefor the preparation of composite with high Ti3SiC2content. By the method of repressing andresintering process, results show that the relative density of the composite is improved withthe increase of the repressing pressure. When the pressure is400MPa, its relative density mayreach95%. So the repressing and resintering process is beneficial to increase density,hardness, conductivity, friction coefficient. By taking friction and wear experiment underelectricity and no electricity, it turns out that the friction coefficient under electric current issmaller than that without electric current, while, the wear volume are just the opposit.By using high velocity compaction to prepare a series of specimen which containingdifferent Ti3SiC2content, and exploring the room temperature and120℃high velocitycompaction on the properties of the specimen. Experimental results show that, at room temperature, the green density and sintered density decreased with the increase of the Ti3SiC2content. The green density is higher than the sintered one. The hardness and resistivityincrease with the Ti3SiC2content increased, when the Ti3SiC2content is35wt%, thehardness is175HB, which is much higher than pure copper. The green density and sintereddensity under room temperature compaction decreased with the increase of Ti3SiC2. And thegreen density is lower than that of the sintered sample. When the Ti3SiC2content is the same,warm compaction is better than room temperature compaction. So preparing sample underhigher temperature is beneficial to improve the comprehensive performance of compositematerials. The bend strenth by warm compaction is higher than those prepared by the roomtemperature compaction, when Ti3SiC2is25wt%, its bend strenth is603.1MPa.Compared with the pressureless sintering and resintering methods, the performance ofhigh velocity compaction samples are significantly better, but its relative density need to beimproved, therefore, taking the spark plasma sintering to prepare the Cu Ti3SiC2composite.Experimental results show that spark plasma sintering can greatly improve the density of thematerial. When the Ti3SiC2content is less than25wt%, its relative density is more than99%,while the Ti3SiC2content is35wt%, its relative density is96.6%. Therefore, the density,hardness, resistivity, and friction coefficient of the sample prepared by spark plasma sinteringhas a great improvement when compared with other processing methods.
Keywords/Search Tags:Cu Ti3SiC2composite, electrical conduction materials, spark plasma sintering
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