The Comprehensive Utilization Of Corn Straw Skin And Pith

The current architectural decoration industry needs a large number of high quality and inexpensive new building and decoration materials. Making full use of crop residues, such as corn straw, to create environmentally friendly composite materials, not only turning waste into wealth but also to find a kind of material that can replace the lumber raw to some extent. So that we not only protect the forest resources, prevent soil erosion, but also reduce carbon emissions and pollution aggravated by deforestation.In this paper, the comprehensive utilization of corn straw skin and pith was studied. First the structure of corn straw, the chemical composition of corn straw skin and pith monomer and their differences in mechanical properties were analyzed and the adverse effects of corn straw pith on the performance of straw particle board were verified by single factor experiments. An effective separation technology of corn straw skin and pith was researched used to completely separate the skin particles from the pith particles. The skin particles were used for the main raw material in production of particleboard, environmentally friendly urea-formaldehyde resin adhesive and the appropriate hot pressing technology has been used, and the impact of four factors (pressing time, pressing temperature, density and sizing) on the performance of particleboard was analyzed by orthogonal experiment. The better production process of corn straw skin composite are determined as below:hot-pressing temperature155℃, hot-pressing time4min (panel thickness is10mm), sizing is12%and density of composite is0.7g·cm-3.The pith particles were compounded with environmentally friendly urea-formaldehyde resin adhesive, heating molded molding process was used, and the effect of density, sizing and interaction of density and sizing on the mechanical properties and sound absorption performance of corn straw pith packaging material were explored. The bonding mechanism and feature of broken sections of corn straw skin was surveyed by scanning electron microscope (SEM); Through the dynamic mechanical thermal analysis (DMA) and thermo gravimetric analysis (TGA), the dynamic thermodynamics properties and thermal stability of the corn straw skin board was analyzed too.The results show that the mechanical properties of corn straw skin particleboard has reached the requirements of the GB/T4897.3-2003with low formaldehyde, low-cost, light weight and high strength advantages, so it is suitable to do the architectural decoration composite. Corn straw pith packaging material has good cushioning properties and sound absorption properties, so it can be suitable to do a cushioning packaging materials and building insulation materials.