A Study On Application Of Statistic Process Control In Bonding Of Nanping Corporation

With the development of the integration of electronic products, chip bonding technology is applied in more and more area. The quality of the bonding affects the reliability of the chip and module, even the whole system directly. Pull force testing is the one of the approaches to evaluate the quality of bonding. Currently, Nanping Corporation uses the 100% inspection in the end of the process, its hysteretic and the spending on man-hour and scrap are huge. The sampling test based on SPC for bonding pull force not only reduces the cost of testing and scrap, but also detects the abnormities in the early stage, timely disposition prevents the escape and diffusion of nonconformance.This thesis applies SPC in bonding pull force control and sets up Xbar-R chart based on the evaluation for the popular. In the following manufacturing process, the test samples 3 groups chips per shift (total 15pcs chips) instead 100% inspection. In the meanwhile, the thesis applies bootstrap approach in the trail run to solve the sample size issue caused by the limited production plan in this phase. As conclusion, more than 30 samples are considered that the tolerance of evaluation with bootstrap in trail run is acceptable. Based on above summing-up and combination of Nanping organization function, it establishes an executive program which applies to trail run and mass production, and implements it on internal SPC system. After 3 months, the profit brought by this program is similar to the expect, cost of quality is reduced obviously. Finally, the thesis puts forward four improvement suggestions against the problems caused in the bonding SPC system.