Based On The Image Processing Techniques To Detect Solder Paste Printing Quality

This paper specifies the quality testing methods in solder paste printing based on the image processing technology.This technology mainly used for Automatic Optic Inspection systems in Surface Mounted Technology assembly process.During recent years, these AOI facilities are popular with most electronics firms. Its simple operation and high speed, can not only raise the production efficiency, but also guarantees the product with high quality. Therefore this technology possesses the giant market prospect and the research value. The testing of solder paste printing on the SMT production line is the first examination, followed with other two important examinations also can take the advantage of AOI. for convenience, the AOI system in the follow text specially refers to the solder paste printing examination with Automatic Optic Inspection.The AOI device is one complex system which combines electricity optics, physics, computer vision and image processing. This system not only includes the image processing analysis software for the solder paste printing, but also includes the part to control the equipment and the data management system.In the first step, we must carry on the localization work for the Printed Circuit Board. This paper uses the Pyramid model, and obtained the approximate locating point through two steps, then obtained the precise locating point by the algorithms base on the connected regions.On the PCB, The solder paste regions is the rich in color and the texture information, This paper gives a method building a statistical model on the color and the texture information, and then get the color image segmentation result of the Printed Circuit Board. For the segmentation result, we use morphology processing and get the connected regions. Compare with the original solder paste regions, we can check the flaw in the solder paste regions on the board.