Study On Direct Writing Conductive Lines By Laser Induced Forward Transfer Technology

The laser direct writing technique is widely used in the fabrication of various microelectronic devices and the repair of the circuit board in recent years. It has many advantages, such as fast, flexible, adaptable, green, high precision, low cost and so on. The laser-induced forward transfer that we are studying is a laser direct writing technique which based on the transfer of the films. In this thesis, the experimental studies on the conductive lines using silver films via laser-induced forward transfer were reported, the main contents are classified as follows:1. The silver films with different thickness were prepared by the different film manufacture process. The silver film with nanometer-scale thickness was fabricated by using the silver mirror reaction and with micrometer-scale thickness was fabricated by using spin-coating and sintering of the silver paste.2. In the silver film of nanometer-scale thickness transfer experiments, the laser processing parameters and other factors on the morphology and conductivity of conductive lines were studied systmatically. The results show that the conductivity of the metal line is very poor. When keeping the reception distance of 40μm, 25% adjacent between a pulse and the next one, the morphology of the lines and the conductivity was improved in a certain extent. By increasing the numbers of transfer and sediment, metal lines were made with a good conductive performance. We analyzed of the reasons for this phenomenon in detail. By increasing thickness of the original films or the number of transferring, the conductivity of the sediment can be significantly increased.3. In the silver film of micrometer-scale thickness transfer experiments, some metal lines with good performance were fabricated by using the 355nm UV laser direct writing processing platform. The conductive line has not only a resistivity which lower 10-6?·m but also a good binding with the receiving substrate. The conductive lines made by this process have some practical value. Finally, we transfer the films of micrometer-scale thickness using 355nm UV laser micro-processing platform, successfully manufacture the rectangle-type micro inductor with air core.