The Temperature Field Simulation And Optimization Of A Secondary Power Distribution Assembly

Presently,the application of the electric equipments becomes more and more wide. Because of density of integration's enhancement and the development trend of small,the space for heat dissipation is getting smaller and smaller,leading to increasingly high temperature in electronic devices. If the heat is not out of the dissemination timely,it will reduced reliability of electronic equipment. Especially in the important fields,such as aviation and spaceflight,the electric equipments'reliability is demanded more strictly. In view of the above,it is essential to study the thermal design and analysis techniques of electronic equipments.As the key technique of solid state switching system,the secondary power distribution assembly (SPDA) applies in aviation and spaceflight widely. This secondary power distribution assembly can produce lots of heat,so the thermal design can influence the reliability of switching system directly. Above all,we should attach more attention to thermal design and analysis techniques. It is very important to enhance the thermal reliability of electronic equipments.This article illustrates the 3D temperature simulating and thermal analysis of a secondary power distribution assembly by the analysis software Icepak,and using Icepak the Zoom-in function on the PCB board inside the chassis; According to the simulation results of the optimum design program; by Icepak optimization software to optimize the parameters of the heat sink, and optimized by orthogonal statistical method to verify the results;Finally,simulize the temperature field on the system level,component level;the results meet the thermal design of secondary power distribution assembly requirements.