Magnetic Field Optimization And Erosion Simulation Of Circle Planar Magnetron Sputtering Target

Magnetron sputtering has been developed as one of the most important technologies in industrial coating. Magnetic field distribution makes important role in the process of magnetron sputtering. The strength and distribution of magnetic field determine the characteristics of the plasma, which affect the quality of film, etched area and the utilization of target. Currently, the majority of the studies are focused on the target erosion via experiments, which are not only expensive but also time-consuming. Obviously, theoretical researches in this field will have important academic and practical values. The main research work of this thesis is as the followings.(1) On the basis of SD-500 multi-target magnetron sputtering system, in order to solve the problem of uneven distribution of magnetic field on target surface, we simulated the magnetic field distribution with ANSYS finite element software, and measured the distribution of magnetic field on target surface with using Gauss meter, to verify the correctness of the modle. We systemically analyzed the influences of target structure parameters on the magnetic field, including uniformity and intensity. The radius and height of inner magnet and the length of shunted piece had relatively big impacts on the uniformity of the magnetic field.(2) Two target models were designed. One model was top rake with pole shoe target, the other was target without pole shoe. Using ANSYS parametric design language to optimum design target structure parameters, we got results as the following. Both of the models can increase the magnetic field uniformity distribution, furthermore, the target without pole shoe should have a wider uniform area. In order to further increase the breadth of uniformity distribution region, we assembled different amounts of shunted pieces on different locations of the copper back board of the target without pole shoe. Through analyzing we found that assembled three shunted pieces on copper back board could increase unifonnity distribution region of horizontal magnetic induction intensity to 15.5mm, accounted for 62% of the target surface, furthermore, the horizontal magnetic induction intensity of sputtering regional central reduced about 10%, accorded the ideal magnetic field distribution condition.(3) The target erosion shape was preliminary studied. Target for the 2mm thick, described the opposite relationship between the magnetic field distribution on the target surface and the shape of the target erosion, and simulated the target erosion shape. After optimized design, the erosion uniformity region of the target was 11～18mm, and the utilization of target was 70.6%. Compared with the existing target structure, the utilization of target was improved 11.06%. Furthermore, the way to increase the width of erosion area by optimized magnetic field is reasonable.