Studying On Preparation And Performance Of Adhesive Used In External Thermal Insulation System

Building energy consumption in total energy consumption in the community has been occupying a large proportion. With the growing of contradiction between energy supply and demand in today's society, it is necessary to actualize building energy saving. As a dominant architectural energy-saving technology, external thermal insulation technology have been extensively using in the world. In the system, insulation material and adhesive are the key components. In recent years, extruded polystyrene panel (XPS panel) and phenolic foam panel (PF panel) using as building insulation material are increasing, while their corresponding adhesive's reports are few. Therefore, the research of high performance adhesive is of not only a certain academic significance, but also broad application prospects.In this paper, core-shell acrylate emulsion is prepared from based monomers n-butyl acrylate, methyl methacrylate and vinyl acetate, functional monomer acrylic acid, and modifying monomer vinyl versatate via semi-continual seed emulsion polymerization. Effect of reaction temperature, the amount of emulsifier,initiator and acrylic acid are studied by orthogonal experiment. The further research about emulsifier's amount,ratio and adding times, pH buffer's amount, modifying monomer's amount is done by single factor experiments.Under optimum conditions, the synthetic polymer emulsion's water resistance, alkali resistance and other properties are good. Using fourier transform infrared spectroscopy (FTIR), differential scanning calorimetry(DSC) and transmission electron microscope(TEM) to characterize the structure of the copolymer, the results indicate that the double bonds take part in the reaction completely and the copolymer is of a core-shell structure.The polymer modified cement mortars as adhesive in external thermal insulation on walls are prepared. Their performance bonding the XPS and PF to the cement block is determined via the tensile bond strength test. The results show the bonding strength to XPS panel satisfies the standard JG149-2003; the bonding strength to PF panel is higher than the strength of the PF panel itself, and the destruction interface is in the PF panel.