Study On The Properties And Bonding Strength Of TiN Films

Material is the basic substance for human beings' living and developing, and hard coating material-one newest type is already becoming very important and being widely used in all walks of life. As the first being industrialization and widely used film/substrate, TiN film has a series of excellent performance and can be used in areas with special requirements for material. Extensive using of TiN film demands higher quality of film itself, therefore, manufacturing TiN films with higher hardness, higher wearing resistance and better bonding strength has been a hot research at home and abroad.Film's quality mainly depends on its manufacture technology. Physical Vapor Deposition and Chemical Vapor Deposition are the common technologys of film preparation. Different methods can be choosed according to different demandsby users.. Magnetic filter Plasma-ion beam deposition system has been used to produce TiN film, meanwhile, characterizes the film and measures it's physical parameters. The scratch test and friction test on the film with Multi-function microtribology and abrasion tester (UMT-2) have been used to investigate the bonding strength of film/substrate system.The cause of residual stresses existing on the interface of film/substrate system has been analysed in this study. The stress profile under thermal loading has been calculated with an established model, and compares to the results of numerical simulation. Discuss the theory about film interface damage and simulate the crack growth process with extended finite element method in ABAQUS, besides, user-defined material subroutine VUMAT combined with cohesive element has been taken to compare the exponential CZM implemented in ABAQUS, then modelied the film/substrate peeling process. Finally, the simulation results were compared to the experimental measurements, meanwhile, analyze the cause of error.