Study On Application Technology Of Electroplating Filling Additive For Printed Circuit Board

At present, the use of printed circuit board via-filling plating additive in our countryalmost entirely supply by the United States Atotech produced,which practical application forgood quality, but the price is expensive, for need purchase their via-filling plating additive andvertical plating matching production lines, that in our country ability to achieve high performancevia-filling plating; so, the small and mediμm enterprises difficult to bear up of the economicpressure and the technical maintenance pressure,Largely hindered the development of thedomestic printed circuit board manufacture，therefore, developement one kind of new printedcircuit board via-filling plating additive which applicable domestic production line is urgentand important.For development new additives, we study the Atotech via-filling plating additive EVF viafill performance and the performance of the plating solution and the obtain results correspondingof standard value as the standard of the newly developed additive.According to the electroplating principle and generally acidic copper plating process inmechanism of additives, for screening each component, then the small scale experiments usethe screening of additives replace with the Atotech via-filling plating additive EVFcorresponding component,obtain each better component, then orthogonal experiment、draw bestadditive recipe combination of plating solution and process conditions.Use scanning electron microscopy characterize the crystalline cross section of the copperlayer,Ductility test the electroplated copper ductility, metallographic microscope test via-fillingcapabilities,dimple,Surface copper thickness,plated with tin furnace test blind hole thermalshock,the results showed that:carry out the studied additives via-filling,electrodeposited coppermicrostructure of polygons,no preferred orientation, and there are some mixed twins,but no grainboundary fracture,copper layer without impurities, filling capacity more than86.5%，dimple isless than12.5μm,surface copper thickness less than19.5μm,ductility25%， high currentefficiency,throwing power and coefficient of variance, plating brightness reaches8degree，3times more resistant to thermal shock.Half year pilot experimen results prove that the plating solution has been stable,the processfor via filling plating panel brightness reach8degree，filling capacity more than85%, dimple isless than15μm,surface copper thickness less than20μm,ductility28%, the crystal structure of thecopper layer is no grain boundary fracture of GB key indicators required by the standard.We developed additive the via-filling capablity equivalent the use of printed circuit boardvia-filling plating additive in our country almost entirely supply by the United States Atotech produced,that our developed additive can replace Atotech EVF additive.