Semiconductor Spin Coating System And Optimize The Design

This paper studies several technical problems in the uniform optical resist step of the current semiconductor lithography technology: uniforming optical resist cavity produces air motion with high-speed rotation of wafer and squeezes optical resist film, affecting the thickness uniformity of optical resist film; The way the wafer adsorbs on the sucker is generally vacuum adsorption. sucker and vacuum adsorption strength both can devote to the deformation of the wafer after adsorption; the problem of splashing optical resist on the back of wafer, reduce the volume of wearing the wafer backside; adjust the rate of uniforming optical resist and bring forward the improvement of motor parts of the uniforming opticak resist equipment.Complex manufacturing processes of Lithography process throughout the semiconductor industry makes it that reliability and stability of lithography technology and the process has an important influence on product quality, finished product rate and cost. Therefore, the stability of the Photolithography process is significant for research to ensure product quality. And uniforming optical resist system as a step of the Photolithography process, has a direct impact on the subsequent sequences and final graphic quality. The graph clarity, the size of line transition region, the viscosity and uniform of optical resist has the close relationship with the centrifugal rotational speed and time.To choose an optimum speed and the appropriate time is the issue a operator is the most concern about.This paper by experiment researches: the influences limitations of uniforming optical resist device have on film thickness and uniformity; the influences uniforming optical resist speed and time has on film thickness and uniformity; the influences prbaking temperature and time has on the effect of the graphics developing; through a series of experiments, to obtain the optimized parameters of uniforming optical resist system in photoetching technologyIn the papers, the use of Auto CAD software, cavity section of new GCA uniforming optical resist device has been reconstructed, so that air in the cavity is easy to discharge. Cleaning system is joined to the uniforming optical resist device, to reduce air current squeezing cellophane which is due to the small uniforming optical resist cavity and poor ventilation, to avoid interference fringe left on cellophane and residual optical resist on uniform optical resist cavity splashed onto the wafer, guaranteeing the uniformity of thickness and quality of the cellophane, reducing the work load of cleaning-up maintenance after optical resist enters the vacuum part and saving the time greatly. Backside cleaning system improves the smoothness of wafer after it enters the photoetching machine; After back cleaned increased the maintenance is to the back cleans the important link which the effect could manifest, the equipment engineers work out the special maintain plan of the backside cleaning, every day check and adjust the backside cleaning to ensure the cleaning effect and analyzes superiority after brushless direct current machine is applied to the uniforming optical resist device through the monitoring datas of electrical machinery part's rotational speed.