Research, For Interconnect Copper Pulse Electroplating Deposition Layer

Pulse plating has been developed from the 1960s as an electroplating technology. It has a broad range of applications: not only in various kinds of conventional electroless plating of high-speed, but also in high-density PCB interconnect vias acid copper plating. In the manufacture nanocrystals, nanomultilayers, application of pulse plating is better than DC plating, so, pulse plating is developing very rapidly.Pulse plating study mainly concentrated in the printed circuit board (PCB) vias copper technology. In recent years, as the rapid development of information technology on the high-performance PCB technology and quality rising, Circuit design requirements tend to thin wire, high-density, small aperture, especially in the HDI PCB micro vias. The DC electroplating is difficult to meet these requirements.Because of copper plating layer's good conductivity, thermal conductivity and mechanical advantages of scalability, it is widely used in the field of electronic information products. Copper electroplating technology also penetrated into the whole area of electronic materials. From the PCB manufacturing to IC packaging, and to large-scale integrated circuits (chips) copper interconnect technology, and other electronics are inseparable from it. Therefore copper electroplating technology has become one of the electroplating technologies in modern microelectronics manufacturing.This paper studies the application of pulse plating copper interconnects in integrated circuits and PCB. Chapter III studied the pulse plating copper coating properties in IC interconnects by three experiments. Experiments 1 studied the copper's properties after annealing under different conditions. Experiment 2 studied the impact of the additives on the pulse plating copper. Experiment 3 studied that three different concentrations of additives to improve the composition of the coating properties of copper had an active role. Chapter IV of the three-dimensional experiment is the production of flexible interconnects, and discussed the application of the pulse plating copper in PCB. With replace copper lines with aluminum in IC interconnection, application of copper pulse plating process is the general trend. At the same time, with the rapid development of information technology on the high-performance PCB technology and quality rising, pulse plating copper plating stand out more of its advantages and application value than the traditional DC plating. Therefore, how to improve the pulse plating copper process will be the research directions in the future.