The Semiconductor Chip Mounting Research, Development And Performance Of The Low-temperature Sintering Silver Based Slurry

To meet the demand of the high-power, miniaturization, lightweight high-density assemble,low-cost, high-performance and high dependability of the electronic package technology, this article choose thelow-temperature sintered silver paste——a new type of electronicpackage material as the research object.The optimized compositiom problem of the conductive phase , binder phase and organic vehicles phaseprepared is studied , and the effect of each phase on the electrical conductivity,the thermal conductivity (TC) and thermal expansion coefficient (CTE) of the paste are researched,The semiconductor chip is assembled by clearning-dryness-low temperature sinterd technics. Laser Granularity Analysis ,DSC, SEM,HA-10 Shear Force Tessting Apparatus were used to study the microstructure ,physics property and shear force. The main conclusions were as follows:(1) Following the increasing of the silver content ,the resistivity obviously decreases and the film become compact. When the proportion of flake silver and globate silver mix together and the silver for solid powder 85%, the resistivity is 4.2×10^-1mn/D and the density of paste film can improved.(2) Following the increasing of glass frit content, the thermal conductivity ( TC) and the thermal expansion coefficient ( CTE) of the paste gradually decrease and the adhesion of chip increases on the contrary.When the glass frit for solid powder 30%,the C TE is 15.2×10^-6·℃^-1, the TC is 182 W/m·K, the adhesion of chip is 29.4N.(3) The lecithin occupies the organic vehicles 1.5% as surfactants,and keep at stable state,the performance has better;Using solvent mixed terpineol and butyl carbitol formal and dibuty (o-) phthalate can got favorable levelling property; The organic vehicles occupies the paste 20% can get better adhesion (37.93N) .(4) For getting the better adhesion of ship,the sinter curve is heating from temperature to 150℃and holding 30 min,then rising temperature to 300℃and holding 30 min,last increasing to peak sintered temperature (430℃) and holding 20～25min(5) Following the increasing of organic vehicles content, the void rate of sinterd film increases. The curve of paste with mixed solvent organic vehicle is smaller than the single solvent . the application of mixed solvent organic can decrease the void rate from 80% to 50%.We can see that the performance of organic vehicles with terpineol and tributyl citrate is better than that with terpineol and butyl carbitol formal and dibuty (o-) phthalate.(6) The high energy ball milling which take some effects on structure of glass frit can make the Particle diameter be thinned down from 20μm to 3.5μm, but there is a limit of the particle diameter, and the best ball milling time is 24h. The high energy ball milling which take some effects on structure that can make the appearances of glass frit particle from chunk to round. The void rate of sinterd film increases along with the increasement of ball milling time . when the ball milling time is 24h, can obtain the better performance and the void of sinterd film is almost disappeared...