Experimental Study On The Three Typical Brittle Materials Grinding

The general character of brittle material is high-intensity, high hardness, great brittleness, wearing resistance, and good in corrosion, thermal insulation, low density, expansion coefficient and chemical stability. Therefore, it is better than metal material. But it is usually used after mechanical processing. However, brittle material has the defect of inductile and microcrack, and its superficial layer is liable to brittle shatter because of processing method, so it is very hard to process. Therefore, how to get high-quality processing surface is a very important research theme in the field of advanced manufacturing engineering.In this thesis the experimental research on grinding of three kinds of typical brittle materials (silicon wafer, ceramics and stone) by the sol-gel polishing tools for polishing was done. The main results of this thesis are summarized as follows:1. In the procedure of polishing silicon wafer by the sol-gel polishing pad made of Al2O3 micro powder, after the pressure force reaches given weight, the processing effect will not increase; after the density reaches given number, the processing effect will get stable; after abrasive material granularity reaches given size, the processing effect will not change; with the increase of rotational speed, the superficial quality will get better gradually; after polishing given time, long-time processing will not affect the effect of the silicon wafer surface.2. The polishing effect of silicon wafer surface by the sol-gel polishing pad made of diamond micro powder is not good.3. When polishing SiC ceramics, the polishing effect of the sol-gel polishing chip is better than the resin polishing disk, and is a little worse than polyurethane disk, but its efficiency is much higher than polyurethane disk.4. In the procedure of polishing stone by sol-gel polishing chip made of diamond, the superficial quality will get better and better with granularity reducing, density increasing and processing time adding, and the surface will become smooth gradually.5. There is a better polishing effect and a higher efficiency to polish low-hardness stone, but the effect is worse and the efficiency is lower to polish high-hardness stone.6. The processing mechanics of the sol-gel polishing chip is similar with conventional fixed abrasive polishing chip, and the most main processing way is little-cut processing and the processing function is the abrasive grains out of binder. But except these, some other abrasive grains in the sol-gel polishing pad roll between workpiece and polishing chip for the purpose of superficial removal and polishing.