Mcm Thermal Analysis And Composite Snpb Solder Joint Stress And Strain Analysis

Today, in the microelectronic industries, on the hand, the technology developing trends of the microelectronic packaging is to make it not only be lighter in heaviness,thinner,smaller,and shorter in size but also be higher density,higher performance and lower cost; On the other hand, the microelectronic products have been widely applied into every field, such as auto industries, telecommunications industries, etc. Sometimes their working circumstance is in badness, their temperature is higher and their heat dissipation is poorer. Thus, reliability of the microelectronic packaging is getting more and more important. We have reason to be believed that the reliability research of the microelectronic packaging will play an important role in the future. In this paper, two aspects were simulated and analyzed with the ANSYS software and FEA simulation. One is the temperature distribution of the military multi-chip module (MMCM) with multiple heat resources; the other is the stress and strain distribution of the duplex SnPb solder joint of the flip chip (FC) packaging in thermal cycle loading. The military multi-chip module (MMCM), which is used to adjust DC motor's rotary, is applied into rocket system. Because the MMCM works in high temperature, its reliability is very important. In this paper, the temperature distribution of the MMCM with multiple heat resources was simulated and analyzed, and that the bond layer material,the substrate material,the case material,the temperature varied of the bottom of case and the convection coefficient of case have effect on the temperature distribution were simulated and analyzed.Through the simulation and analysis good agreement with the experimental data was obtained, which demonstrated the effectiveness of the simulation method, and some conclusions were obtained. (1) Because there was thermal-coupled in multiple heat resources, the temperature distribution of a packaging with multiple heat resources was different from single heat resources. (2) The simulation results showed that the heat path from chip to the bottom surface of the packaging was the main way for the dissipation of heat. Thus, in thermal design the thermal resistance from chip to the bottom surface of the packaging should reduce, while the material of the great thermal coefficient should use. Through the convection coefficient applied on the other surface had little effect on the temperature distribution of the MMCM, the temperature varied of the bottom of case had greatly effect on the temperature distribution. Thus, in thermal design the...