.fe / Cu Deposited Weld Interface Combining System

To meet the special needs of military workpiece, a novel welding technique was developed, which called brazing-piling welding method. In this paper, with the help of OM (Optical Microscopy), SEM (Scanning Electron Microscopy), TEM (Transmission Electron Microscopy) and EDS (Energy Dispersive Spectroscopy), the bonding mechanism on the interface (Fe/Cu) formed by welding of melted copper on steel substrate was examined and studied, respectively. The bonding mechanism on the interface of Copper and Steel is atomic bonding.The experiments of tensile strength and shearing test were conducted or employed in order to evaluate the mechanical performance on the interface. The results showed that both the tensile strength and the shearing strength are satisfied. It can be deduced that the mechanical performance on the interface is excellent.Furthermore, based upon the TEM observation and SEM study, the microscopic interface is straight and smooth, which showed the bonding on the interface of Copper and Steel is wonderful, with a fewer Fe segregation in the matrix of Cu and Cu penetration in the Fe matrix discovered along the grain boundaries.Finally, sufficient experiment data and scientific proofs were obtained. They can prove that bonding mechanism on the interface is a metallurgical process. However, the research work in this thesis is only an elementary study about the bonding mechanism on the interface of Copper and Steel. More systematical further work should be conducted.