| A modified resin system with high performance has been obtained by copolymerization of 4,4'-diphenylbismaleimide, diallylbisphenol A, bromize epoxy, dicyandiamide with suitable proportion and prepolymerization. Using the modified resin system as matrix, and the glass fiber as reinforcement, and acetone as main solvent, the impregnant and half-cured sheet with fine properties are prepared, what's more, the copper clad laminate based on the modified resin system show good mechanical and dielectrical properties. The finest resin system is settled down through experiment and analysis. The solubility, curing kinetic and mechanism of the modified resin are studied by FTIR infrared and DSC apparatus, as well as the confect of impregnant, impregating, dryness and laminate processing of the copper clad laminate. |
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