Synthesis And Characterization Ofmicroencapsulated Phase Change Material Using Mf And Pu As Shell

Microencapsulation technology is used for packaging phase change materials to solve the flow of phase change material,flow and slove the proplem of the compatibility with matrix material, The phase change material is used in the construction industry, not only reducing the building energy consumption but also save energy. In this paper, we researched about the preparation of different wall of microencapsulated phase change material,the morphology and properties of the products were characterized.The results showed that the preparation of melamine-formaldehyde resin as wall material of the microcapsule, the use of Tween and OP-10 as emulsifier can get smooth phase change microcapsules, when use Tween as emulsifier can get uniform particle size distribution, without agglomeration. When the polymerization temperature is 65°C the surface morphology of the microcapsules is smooth and have excellent penetration resistance,while emulsifier is 10% of octadecane, the dispersibility of microcapsule is good. When the reaction time was 4 hours the surface of microcapsules will be most smooth and get uniform particle size.When using interfacial polymerization method to get the microcaps ules by PU resin shell material,using IPDI reaction with amine,IPDI have lower toxic than TDI.When using PVA as emulsifier can get microcapsules clean, large microcapsule size, there will be sunken, wrinkled and shell cracking phenomenon. When using OP-10 as emulsifier can get microcapsule with smooth surface, small particle size and shell cracking phenomenon is less.This paper use in-situ polymerization to prepare melamine formaldehyde double-shell phase change microcapsules.By interfacial polymerization toprepare polyurea resin as the inside shell and MF resin as out side shell by in-situ polymerization.The results show, polyurea- Melamine formaldehyde resin have excellent shell penetration resistance, while melamine formaldehyde double-shell phase change microcapsules have highest enthalpy. The heat resistance temperature of the microcapsules can largely improved when using of wall mater ial to package the core material.