The Research Of Co-Continuous Phase Thermal Conductive Material On Preparation Technology

In this paper, through the experimental method, the co-continuous phase was studied which based thermal conductive polymer materials forming conditions and preparation process.To study the effects of component ratio and filler content on the phase behavior structure, thermal properties and mechanical properties of blends. Through the method of experiment, mainly on the special co-continuous phase structure of multilayer composite thermal conductive polymer materials were studied. The effects of component ratio and filler content was Analysed on the thermal properties and mechanical properties of composite materials. By means of simulation and experiment, analysis of the influence of the coefficient of thermal conductivity and the microstructure of the fin was analysed on the thermal performance.Results show that:1. PP/HIPS co-continuous phase structure of polymer blends was formed in the mass fraction of HIPS in 40-60wt%. The two phase in the composite component content had a great influence on the phase structure of the blends.Through the analysis of the continuous phase coefficient by solvent extraction experiment, also showed that the range of HIPS content in 40%-60%. In the two-phase system formed the interaction of co-continuous phase sea-sea structure.2. The mechanical properties of polymers could be used to determine the phase morphology of polymer. By analyzing the relationship between strength and the tensile curve of content, found that blends form co-continuous phase structure in the vicinity of the content of HIPS 30%-60%. Through the analysis of bending strength, impact strength and the curve of HIPS content, HIPS content in the range of 30%-70% blends in this range, the co-continuous structure was formed. Blend melt flow rate with the increase of HIPS content, it was increased first and then decreased. Two kinds of materials were studied, especially the content of HIPS in the range of 30%-60%, was conducive to the molding material.3. Blend A1N filler was filled in PP, and verified by EDS AlN distribution in PP. Through the analysis of electron micrographs of PP-A1N/HIPS composite, found the co-continuous structure existed in the mass fraction of HIPS in 40-55wt%. After put the AlN conductive fillers in composite materials, the formation of co-continuous phase structure was smaller. Through the analysis of the continuous phase coefficient by solvent extraction experiment results also showed that adding AlN, thermal conductive fillers in composite materials, the formation of co-continuous phase structure was smaller. The mass fraction of good continuity of co-continuous structures that existed in HIPS was in the range of 40%-55%.4. The tensile properties of multilayer composite was better than that of same component blends. With the number of layers, the tensile properties increased gradually. When multilayer composites and blends the composition ratio of graphite was PP- /HIPS=3/7, influence of layers of multilayer composite materials on the thermal conductivity ofcomposite materials was very small. The coefficient of thermal conductivity on thermal conductivity was to meet the basic formula. The tensile properties of multilayer composite material was better than that of blending materials. Thermal conductivity in a certain direction of multilayer composite materials was in excellent properties, and blend in the three-dimensional direction was isotropic thermal conductivity.5. Thermal performance of a fin of the micro structure was significantly higher than the innon micro fin structure. Thermal performance of micro fin structures of rectangular micro fin structures were optimal, followed by semi micro structure and micro structure of triangular. The rectangular structure height was 0.4mm, width was 0.5mm, the distance between the microstructure was set to 0.5mm, the heat dissipation performance was better. When the thermal conductivity of polymer materials was less than 8 W·(m·K)-1, with the increase of the coefficient of thermal conductivity of polymer materials, the highest temperature of CPU decreased quickly. When the thermal conductivity of the material was more than 8 W·(m·K)-1, with the increase of the coefficient of thermal conductivity of polymer materials, the highest temperature of CPU was not significantly reduced. Manufacturing the radiator fin heat conduction coefficient of thermal conductivity of polymer materials in 8W·(m·K)-1 near, could achieve a good performance of radiator fin.