Multichip Modules Substrates Of Thermal Effects And Thermal Stress Analysis

With the development of electronic packaging technology, the time criterion and the space criterion of heat transfer have been becoming smaller and smaller, which results in the stronger Non-Fourier effect. Still using the classical Fourier model to analyse the heat transfer of the substrate, that will inevitably make the result deviate from the actual conditions greatly.This paper regards the Fourier model and the Non-Fourier model separately, set up their own mathematics-physics equations to the heat-transfer model of three-dimension MCM substrate, adopt FEM to solve the corresponding equations, and get the temperature field of the three-dimensional substrate model. The temperature field is exerted to the finite element model as the body load to calculate the thermal stress of the substrate model utilizing the ANSYS.The results indicate that, compared with the classical Fourier model, the results of Non-Fourier model have great differences: the temperature value is higher, temperature field takes longer time to enter the stable state, changing of the temperature is faster, the phenomenon of thermal coupling is stronger too. Meanwhile, it may have greater thermal stress that in heat sources that dissipate heavy heat, in restrained surface, and the model border areas.The thermal analysis of MCM in the past is less likely to adopt Non-Fourier model. The analysis course and method in this paper may be used to study the Non-Fourier effect in electronic packaging for reference.