Study On Ultraviolet-Curing Diamond Wire Saw Using Nonmetallic Core Wire

Fixed abrasive wire saw is considered as one of the most promising methods in slicing of large size semiconductor silicon wafer because of its incomparable advantages. Recently the manufacturing through reduces the metallic wire saw’s diameter to reduce the loose of the kerfs, sequentially to reduces the production cost. however, its intensity was reduced which is difficultly to meet the normal cutting requirement. In addition, the manufacturing of traditional wire saw also has many problems, such as complex manufacture, long productive efficiency, high cost, easy to cause environmental pollution and so on. Based on that, the paper proposed a new manufacture which using the high strength nonmetallic material as core wire, using the ultraviolet-curing manufacture which can manufacture diamond wire saw fast and cleanly. The paper mainly completes the following several content:1. Determined the wire saw’s primary materials through the performance experiment. Selected the high strength polyethylene wire as core wire, WF-106 as the resin adhensive of the ultraviolet-curing manufacture, and chose the nickel-plating diamond as grins.2. Research the influence of different surface treatment method to nonmetallic core and resin adhesive bonding quality. The result indicated: compared with other two surface treatment, the chromic acid process is better to improve bonding strength between the core wire and the adhesive obviously; The process time and temperature of chromic acid process play the decisive role to the adhesion. The experimental study indicated that the polyethylene wire processing 4min in the chromic acid of temperature for 80-85℃the optima performance can be obtained.3. Researched the solidified process of ultraviolet-curing nonmetallic core wire saw, realized the wire saw’s better and continuous coating adhesive layer, completed wire saw’s good solidified formation and realized the wire saw fast, cleanly production.4. Studied the cutting and machining performance of the nonmetallic core wire saw. Through the silicon crystal’s cutting experiment, The result indicated:the nonmetallic core wire saw had continual, good cutting performance and cutting efficiency is close to the plating wire saw. After the cutting, silicon chip’s surface roughness Ra can reach 0.098μm, the processing surface roughness is high.5. Researched the nonmetallic core wire saw’s fail principle, and analyzed the wear performance of the nonmetallic core wire saw in the cutting process. The result indicated: Used the chromic acid solution is the effective way to improve the bonding strength between the polyethylene core wire and the adhesive, improved the nonmetallic core wire saw’s wear performance, and the service life enhanced.