Effect Of SiC On Microstructure And Property Of C194Alloy

The arrival of information age made the integrated circuit (IC) becomes the core of electronicinformation technology. Lead Frame Material play an important role in the product manufacture becauseof that it is the major component of the IC. The consumption of C194alloy is more than65%ofthe whole consumption of the Lead Frame Materials as C194is the most important material inCu-Fe-P copper alloy. The study of Lead Frame Material started in the middle of1980s in China,while the core technology grasped by the few developed countries, so the development and updateof the Lead Frame Materials product is lag far behind in China. High precision Lead FrameMaterial imports more than90%. This situation seriously affects the development of electronicinformation technology in our country. In2011the State Council has a strategic emerging industry,including the integrated circuit of the information technology industry. For the lightweight trend ofthe development of microelectronics technology, independent research and development of highperformance Lead Frame Materials and further development in the performance of C194alloy hasimportant significance.In this research, we study the C194alloy by adding SiC particles in it, to study theperformance of the as-cast alloy, hot rolled state alloy, solid solution state alloy, cold rolled statealloy and aging state alloy in order to get a kind of new Lead Frame Material which has excellentcomprehensive performance. This research focuses on the studied of the effect of grain refining,hardness, strength, conductive, thermal conductivity, wear resistance from the addition of SiC andthe performance difference of the alloy between the normal casting and casting at theelectromagnetic field. The main work and results is as follows:(1) Addition of SiC in C194alloy can effectively promote the generation of crystal nucleusand make the crystal quantity increases by the time of solidification, the grain size decrease. In theprocess of casting, electromagnetic stirring is helpful to add SiC in the alloy. The SiC content ofthe alloy is about twice after electromagnetic stirring, alloy grain refinement effect increased byelectromagnetic stirring.(2) Addition of SiC can effectively reduce the coefficient of friction of C194alloy, thecoefficient of friction is1.48when add0.8%of SiC，which reduced by72.8%than the C194alloycontains no SiC. Addition of SiC change the friction and wear mechanism of C194from theadhesive wear to abrasive wear, improve the wear resistance of C194alloy. Besides, small amountof SiC can improve the thermal conductivity of the as-cast alloy. (3) The comprehensive performance of the C194alloy is good when add0.6%of SiC whichcold rolling working rate is85%and aging treatment at375℃×2h. The addition of SiC effectiveimproves the strength of the C194alloy. The tensile strength of the alloy is339.03MPa which wasadded0.6%of SiC, increased by7.7%than the C194alloy contains no SiC. Confirmed by TEMand XRD detection, the strengthening phase is-Fe，Fe3P and SiC. In addition, the twin alsoplayed a part in the alloy strengthening. It can be confirmed by the SEM test that total number oftensile fracture increased after aging, the depth of them increased, elongation of the aging statealloy is between7%and12%while elongation of cold rolling state alloy is between4.32%and5.6%, the toughness increased.