Finte Element Analysis Of New Process For Manufacturing Super-thick Plate By Electro-slag Fusion

With the development of equipment manufacturing industry such asship manufacturing and oceanic construction, the whole manufacturingindustry needs more and more super-thick plate as its raw billet. Generally,we define the steel plate that its thickness is more than60mm as super-thickplate. During the process of manufacturing super-thick plate, we need to rollthe billet by a certain rolling ratio. Therefore, the quality of raw billet playsan important role in manufacturing plate. In domestic market, we have ahigh production but we don’t have enough abilities to manufacture the superraw billet for super-thick plates. So, taking actions to explore newtechnology for manufacturing super raw billet which is thicker than400mmand weighs more than40t will be meaningful.Baosteel always denotes itself to explore the advanced iron&steelproducts for domestic market. After considering the existing methods ofmanufacturing raw billets for super-thick plates in domestic and foreignfield, Baosteel decides to explore new process to making raw billets forsuper-thick plates by low cost and in a high quality.We choose the software-ANSYS13.0as our exploring platform to takeresearch on the manufacturing process for raw billets for super-thick plates.This process is very complex because it concludes more than one phase andphysical field. After attempting the fluent and electro-magnetic analysis, wefinally choose the thermal and electric analysis as our methods. During theresearch, we establish the thermal and electric field model, select boundaryconditions to compute the system’s temperature and electric field distribution. Our effects provide theory evidences for manufacturing rawbillets for super-thick plate process. We conclude the key parameters whichplays a significant role for the later production construction. Our researchmainly concludes the following three parts.(1) We introduce time variable to our steady current conduction&temperature field in ANSYS13.0platform. Considering for simplifying ourcomputing process, we establish two-dimension model to find out the hidinglaw behind the process. During the electric and temperature field changingprocess, we find the priority melt problem between the electrode and parentplate. The finite element analysis indicates our electroslag fusion has aharder temperature condition in slag pool compared with electroslagremelting. There is an important key parameter K, promptly filling ratio(thickness of electrode/thickness of fusion seam). We believe that Kbetween0.5～0.7might be preferable in our process, considering both theefficiency and stability.(2) We still introduce time variable to our steady current conduction&temperature field in ANSYS13.0platform. This time, we establishtri-dimension model for further research. Though the tri-dimension electricfield analysis, we find the defect in the process so that we improve theprocess by rise the ratio between the length of electrode and the parent plates.Meanwhile, the tri-dimension temperature field analysis display a result theJoule heat might gather in the middle of the slag pool so that our electrodewould be melted in-homogenously, which would lead to short-circuit. So weimprove the process by taking measure to keep the boundary plate warm.