Development Of Diamond Grinding Wheels Used For Ultrasonic Assisted Grinding Based On Brazing Process

Currently, the grains of diamond grinding tools used for axial ultrasonic assisted grinding aremostly disordered arrangement, which limited the function of ultrasonic vibration. In traditionalelectroplating or sintering diamond wheel, the diamond grains are buried mechanically, so the grainsholding force is small, and they are inclined to fall off during grinding. Diamond brazing, which hashigh binding strength, can efficiently improve the tool life. In view of this, brazed diamond grindingwheels with regularly distributed grains are developed for ultrasonic assisted grinding. The result ofthis research could provide the tool support for machining hard and brittle materials.The main contents are as follows:(1) The tool material was select through the experiment of infrared temperature measurement andultrasonic amplitude measurement. Based on finite element simulation, the tool structure wasdesigned considering the ultrasonic vibration system’s resonant frequency and mode of vibrationobtained through modal analysis.(2) Single grain undeformed maximum chip thickness was derived through single grain kinematicanalysis based on the experiment of single grain sliding friction. And the arrangement of grains on thewheel was determined by the simulation analysis of abrasive cluster trajectories. At last, monolayerbrazed diamond grinding wheels with regularly distributed grains was manufactured.(3) The experiment of using brazed diamond grinding wheel to grind SiC ceramics with or withoutultrasonic was conducted to evaluate the grinding performance in terms of grinding force, grindingsurface integrity and specific grinding energy.