Design Software System Of Visual In Sepection Of BGA In SMT With X-Ray

For the compactness, convenient, connection to network and multimedia of electronical products, SMT(Surface Mount Technology)is becoming more and more widely used in the electronically industry, moreover, it partly even completely takes the place of the traditional assembly technology in some fields. The emerge of SMT results in a great change of the electronically assembly technology. Therefore, it is required to advanced technologies for detection of the assembly of electronic goods AXI (Automated X-ray Inspection) is the only existing detection BGA (Ball Grid Array) ball grid array method, adding the AOI detection of deficiencies. In Surface Mount Technology (SMT) production line, Automated X-ray Inspection systems use charge-coupled device (CCD) cameras to acquire images of the circuit board, and then the images are analyzed to determine whether there are defects in each area of the BGA elements.In this paper, researches were taken on the Automatic X-ray Inspection System in SMT production line.Use the image processing and analysis on filters,two values and the border inspection.The solution of Automated X-ray Inspection to SMT production quality inspection has been introduced. To solve the problem how to detect the solder's bridging and empty issues, etc. Using Karhunen-Loeve (K-L) transform to extract image features solder joint defects, for SVM (Support Vectors Minimizatiort) defect classification. Through the area of the mark, the edge of the inspection, and the hough changing locate the coordinate on the location and identification of image,and then calculate some defects image of the most defects, the element of the most defects with statistics; Completed the process of preparation and the corresponding actual test content; Through plenty of tests, the algorithm and program applied were proved right, the inspection to BGA solder joint defects of SMT was finally realized. The anticipated research goal was achieved.