Research On Deep UV-lithography On Thick Photoresist Technology

MEMS technology is a hot topic of science and industry in the 21st century, and micro-fabrication technologies are the key to the MEMS development. In the MEMS field, microstructure with high height and high aspect ratio is often used. LIGA technology are the way to fabricate this microstructures. The exposal source of LIGA technology is expensive synchrotron radiation X-ray, so that constrains it's wide application.The UV-LIGA technology provided by this is substituted for LIGA technology to use ultraviolet as the source for SU-8 photoresist lithography in the paper. The microstructures with high-aspect-ratio and vertical sidewalls can be patterned by SU-8 photoresist. Various high aspect ratio microstructures were prepared on the basis of UV-LIGA technique by using a new type of SU-8 photoresist, and prepared on defferent substrates. The influences of parameters, such as bake, exposure and development and so on, on high aspect ratio microstructures are mainly discussed. Based on a series of contrast experments,the UV-lithography process is optimized and the highest aspect ratio of microstructures with 2:1 is sucessfully obtained.