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Research On Chip Detection And Location Technology Based On Machine Vision

Posted on:2010-10-31Degree:MasterType:Thesis
Country:ChinaCandidate:J LuFull Text:PDF
GTID:2178360275499260Subject:Circuits and Systems
Abstract/Summary:PDF Full Text Request
ultrasonic Wire welding machine is used in semiconductor manufacturing processes which welding the chip and pin outside the framework. In view of the semiconductor production of ultrasonic wire welding semi-automatic machine of the status, this paper presents the design of the automated welding machine thinking. Focus on the ultrasonic wire welding machine's image acquisition systems, automatic control systems and image processing system. Image processing system which is the core of this article.The whole system is use of computers and PLC's resources which realize the fact that PC real-time monitoring the PLC. It set up a special surface-mount chip and pin of the framework of the visual detection system. CCD camera and image acquisition card send the chip image to the image Collected computers. we make use of image processing algorithms to prepare the appropriate software for image data processing and testing that achieve a surface mount chip intelligent detection and location. Papers focus on the following aspects:(1). System design and system calibration studies; (2). Welding chip platform for the control strategy; (3).Chip detection and location's Algorithm and amend coordinates' research.The speed and accuracy of the system is still able to meet the welding production line when chips image has a slight shift and rotation. It has greatly improved the chip production technology, which has a very good market prospects. At the same time, it is also an important reference for China that carry out the semiconductor equipment manufacturing process development.
Keywords/Search Tags:Machine Vision, Image Processing, Template Matching, PLC Communication, Chip Location
PDF Full Text Request
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