The Study Based On Characteristics Of Stencil Opening Hole In The Solder Paste Deposition Process

The solder paste stencil printing process is the first and the significant assembly process procedure in SMT process. It had been shown that 52%~70% of the assembly defects were caused by the improper setup of the printing process. In general, the factors that influence the production yield of the printing process can be categorized as the stencil design, the operation environment, the features of the paste been used and the parameters of the printer setup. According to different types of packaging components welding spot demand,maintain an appropriate stannising quantity and the quality of printing consistency,which is the key problem in today production.With the application of the statistical techniques and gathering material tools, this research try to explore the relationship between the characteristics of varied of stencil aperture geometries and the volume of paste during the deposition process through field data. Using 3-D laser scanning detection equipment Solder collect data about drop-tin thickness, area and volume. The aspect ratio and area ratio were applied as an index to evaluate and describe various paste-printing performances during this research. With the conclusions drawn from the results,it is expected that higher first pass yield and more robust printing operations can be achieved in today's mass production enviroment.