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Process Mechanics Modeling Of Pressure Sensor Packaging And High-Brightness LED Packaging

Posted on:2007-10-31Degree:MasterType:Thesis
Country:ChinaCandidate:W M LiuFull Text:PDF
GTID:2178360242461049Subject:Mechanical Manufacturing and Automation
Abstract/Summary:PDF Full Text Request
With the development of technology of the MEMS and the MEMS packaging, the devices are used in more wide areas, such as aviation, aerospace, automobile, biomedical science, the environment supervision and military etc. Among the MEMS technologies, the packaging of MEMS is the key point in technology. About 80 percent of the cost of a MEMS device are attributed to packaging. Moreover, many problems on reliability are caused in packaging process. Usually, there are several layers and materials in the MEMS-device. Because of different mechanical and thermic characteristics, there is a mismatch phenomenon. This is the main factor to the failure in packaging. Therefore, We put forward the concept of MEMS process mechanics. Much more researches are done about this concept in this paper.First of all, methods of research on the process mechanics are introduced in this paper, and the finite element analysis are applied to the research on the process mechanics. Next, the rules of modeling and meshing are also introduced, as well as the meshing arithmetic. Some useful experience are presented about FEA tools, such as FEMLAB, ANSYS, ABAQUS, and HYPERWORKS, FLUENT etc. And then the quality and refraining standard are construed. At last, two kinds of models are Elaborated on MEMS device and its packaging.The models of MEMS pressure sensor are created. Three sets of parameters, which are taken from the empirical formula, are analyzed, compared and verified by the experiments. Some data on MEMS pressure sensor are given by experiments. The bright-LED models with single chip and multi-chip are built up. It is enunciated by numeric simulation with single-chip LED. The more the temperature grade is, the more hugely the energy decreases. There is a stress concentration around the chip. What's more, some research on the multi-chip LED are done carefully to describe the relationship between temperature field and the powder of chip. It is verified by numeric simulation that the higher the velocity of flow water, the lower the temperature on LED. At last, some data are given by the experiments.
Keywords/Search Tags:Process mechanics, Finite element method, Micro pressure sensor, Bright LED, MCD-LED
PDF Full Text Request
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