Study On Stacking Packaging And Assembling Technology

Substantial size reductions are achieved and interconnecting usability and accessibility are increased by using of the 3D stacking packaging configuration, which is one of the most important trends of the novel packaging technology. Based on a lot of serious investigating and fully use of technology and technics in China, a kind of novel 3D stacking packaging structure is provided, and the technics are validated. We have done some works in the area of the novel packaging technology in our country, and provided the feasible plan for manufacturing. Main works are introduced in details:1. A novel 3D stacking structure is introduced. Studing on micro-opto-electronical inspecting equipments home and abroad, integrated with the demands of our system, a novel 3D stacking packaging structure is introduced, in which the interconnection is achieved by sidewalls and the top-bottom pads are distributed. Also, several other structures are anylysed whose pads are similar as ours.2. The manufacturing plan of packaging structure is provided. Based on fully investigating the technics home, the plan of LTCC and BUM is introduced seperately, including material properties, and comparasion of two plans.3. Base on the technics of PCB, the feasibility of manufacturing plan is validated. Many works have been done on reflowing welding, including designing and producing some assisited tools, and finding the proper temperature curve for the welding machine.