Robotics Ball Attachment Workcell For Ball Grid Array Semiconductor Packages

Along with the growing functions of electronic product, the pin numbers if IC packaging is growing fast while the size reduced obviously. The traditional packaging method can't fill the need of new requirements, so Ball Grid Array (BGA) becomes the leading method of IC packaging. New packaging technology brings forward new challenge for semiconductor packaging device. The demands of BGA chips grows quickly, so that the market has a bad need of new automatic BGA packaging device.For the moment,the study of BGA packaging device is just begin. This machine will fill up the blankness and its technology performance reaches an advanced level in the BGA automatic packaging field in domestic.This paper studies a low cost, but high efficiency, automated ball attachment workcell. The followings have been achieced in this paper:a) Analyzes the survey of semiconductor package technology overseas and domestic, and put forward the need of development of equipment platform of Ball Attachment Workcell For Ball Grid Array Semiconductor Packages.b) Designs a whole scheme of STAR-04Z automated ball attachment workcell. Study the theory of vacuum sucking method for ball attachment technology and the system composement of the BGA automated ball attachment workcell.Farther more, finish the structure design of the model machine. At the same time, this paper relates the crucial problems which affect the quality of ball attachment and discusses the application of parameter design theory in the design process of BGA ball attachment.c) Put forwards a structure model for image inspection and accurate orientation of the BGA automated ball attachment workcell ,which composes of currency hardware&software.Analysis and discussion indicates that the whole scheme and the model machine we designed are able to meet the need of the market. Our study makes an important beginning for BGA packaging technology ang equipments in China.