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The Study Of The Temperature-stress Coupling Field Of Disc Pad Based On Material Matching

Posted on:2010-09-16Degree:MasterType:Thesis
Country:ChinaCandidate:W XuFull Text:PDF
GTID:2132360275951619Subject:Mechanical design and theory
Abstract/Summary:PDF Full Text Request
The material matching of disc brake has greatly affects for its braking performance. In the thesis, the effect factor is discussed based on the matching and physical and mechanical characteristics of the braking materials.The mechanisms of the braking heat and heat partition as well temperature and stress fields of the braking process have been investigated in the thesis. Based on the theory above, a temperature-stress coupling model has been established and used to analyze the temperature-stress coupling field.For studying regular of the temperature-stress coupling field, a braking analyzing system has been established. The system not only can carried out the nesting of C++ language and APDL languages, but also complete the structure parameter and material parameter design. It is evident that the system conveniently provides for the temperature-stress coupling field the emulation design of brake.Maximum values of temperature and stress have been discussed Based on the system above and ANSYS software as well material matching. The research shown that that lower density, elastic modulus and thermal expansion coefficient will benefit to decrease the maximum values of the temperature and stress , and to delay the time of reaching maximum value and promote the braking performance.In the thesis, the each effect of the temperature and stress fields is discussed. The results shown that there are different distribution of temperature and stress in different positions of braking pad, and that the structure of pad greatly affects the coupling field.The research also shown that the temperature and stress of pad can be decreased and the capability can be improved in braking process by increasing thickness of steel back of the pad.
Keywords/Search Tags:Temperature-stress coupling field, APDL, Material parameterized, Heat conduction coefficient, Thermal expansion coefficient, Brake
PDF Full Text Request
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