Numerical Simulation Of The Effects Of Shield Tunneling On Soil And Buildings

It is a trend to exploit the underground space in the development of the modern city. As one of the methods in tunnel construction,shield tunneling is employed by many country in world because of its advantages. The effects which induced by the underground space exploitation on the surrounding clay and buildings are inevitable. Base on these,the follow items are studied:Firstly,the research background and the shield tunnel are introduced; the research present state about the effect of the shield tunneling on surrounding is summarized and the works in the thesis are presented.Secondly,the soil performances and its behavior mechanism induced by shield tunneling is explained; the effects on buildings caused by shield tunneling are stated including the possible damage forms of the buildings,the range of the effects,criterions and the methods of prediction.Thirdly,base on the project of the Wuhan Yangtze double-tube parallel tunnel excavating,the shield tunneling is simulated in the 2D plane strain condition,while primarily aiming at different soil loss and different burial depth of tunnel to analysis,so the soil movement relationship with the soil loss and burial depth of tunnel is concluded; Base on the left tunnel excavating,the shield tunneling is simulated in the 3D finite element method,while the transferring stiffness method is put forward to imitate moving-forward shield process,and also how to simulate the soil loss by method of stress release is explained,for the nonlinear of soil,lamination of soil,grouting are considered,tree-dimensional effect on soil induced by shield excavating is concluded.At last,base on the front modeling method,the building model is put on the surface of the soil model,for the different weight building is considered; ABAQUS contact definition is put forward to imitate soil and pile interaction during tunnel excavating. Some conclusions are summarized to provide corresponding guidance for subsequent project.