Study On Thermal Analysis And Thermal Design Of DC/DC Modular Circuit Based On ANSYS

The thermal analysis and design of DC/DC modular circuit (DC/DC) are very important and indispensable because these are the key step to raise the reliability of DC/DC, which usually work in the circumstance of high temperature and high moisture. The thesis has made a thorough research of the thermal analysis and design of DC/DC with the help of the finite element software(ANSYS11.0) to evaluate nicely and quickly the thermal performance,which is deeply influenced by packaging parameters,and puts forward the methods to improve the radiating performance and reliability of DC/DC,Moreover,the thesis presents five projects that improve the radiating performance of large-power DC/DC on the basis of analyzing the thermal performance of large-power DC/DC using the software (ANSYS11.0). In general the main work of this thesis follow as:1.According to the DC/DC under the different outer circumstances & packaging parameters,taking good advantages of finite element thermal simulation technique,I have analyzed the 3-D temperature field of the DC/DC and the main influencing factors of thermal performance of DC/DC in this article,which involve the temperature on the ground boar of packaging,the conductivity factors of cementation layer,the material of base plate and the ground plate for packaging,topology of electrical circuit,schemethe power density of chip and the outer circumstances.2. According to high power DC/DC,taking advantage of the finite element thermal simulation technique,6 thermal design measures are taken to make better step by step. These 6 measures,which have provided good references for improving the reliability and radiating performance of large-power DC/DC,include:(1)the improving of placode material and splice material;(2) the improving of baseboard material;(3) the improving of structure of baseboard radiator;(4)the using of diathermancy filling;(5) the improving of chip area;(6)optimization topology of electrical circuit.At the same time Study temperature control of using high power DC/DC adopt the finite element simulation technique of thermal-fluid coupling.3. By way of thermal analysis and design of DC/DC,reliable analyzing & designing data have been provided for the DC/DC design. The practice shows that the design satisfied the technical demand and the result can be put into multi-produce.