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The Experiment Research On The Convective Heat Transfer Of High-Density Assembly Microchannel

Posted on:2009-03-11Degree:MasterType:Thesis
Country:ChinaCandidate:Y K WangFull Text:PDF
GTID:2132360242978028Subject:Mechanical and electrical engineering
Abstract/Summary:PDF Full Text Request
Based on the mechanisms of microfluidics and micro heat transfer theories, the analytical resolutions of velocity filed and temperature filed were obtained for the convective heat transfer equation of microchannel(slot) considering the boundary conditions of velocity slip and temperature jump. And the new expression of Nusselt number and coefficient of temperature jump were obtained.The correlations of the convection heat transfer were obtained combining with the boundary condition of axial wall heat conduction. Then compared with the classical heat transfer correlations by processing the experimental data, the experimental results certify that the two results of Nusselt number has little difference. It is shown that both of heat transfer correlations can be used in the experiment of convective heat transfer of microchannel.The experimental equipment of high-density assembly was established, the experiment was actualize. Experiment results suggest that the Nusselt number obtained by using the micro heat transfer correlations is significantly less than classical value. But in the micro heat transfer theory sense, the Nusselt number derived from experiment with considering the coefficient of velocity slip which expressed wall characteristic is more approach to the classical one. It is shown that the design of microchannel can only be based on the theories of micro heat transfer and the classical theory can not be used to microchannel design.It is shown that the high-density assembly microchannel heat exchanger has many advantages, such as small size, high heat transfer performance. The given theory can be used for the design of high-density assembly for computer chips and microchannel network heat exchanger.
Keywords/Search Tags:High-Density Assembly, Microchannel, Micro Heat Transfer
PDF Full Text Request
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