Investigation On Application Of A Flat－Plate Heat Pipe To Cooling Aeronautical Electronics Component

This paper aims at the study of a flat-plate heat pipe used in aeronautic electronic components. A flat-plat heat pipe was designed and fabricated. Analytical model was developed for steady state of the flat-plate heat pipe. An experiment investigation of the heat pipe and a solid flat-plate heat sink of same size were carried out, and their results were compared with, which shows such advantages as quicker startup, more symmetrical temperature performance and better heat transfer performance. The model solves the properly steady heat conduction equations for the heat pipe wall and liquid-wick regions. A steady state, three-dimensional approximation is used for the vapor steady behavior. The heat transfer within the wall and liquid-wick regions is coupled with the vapor phase at the liquid-vapor interfaces. The simulation of the steady temperature field of the flat-plate heat pipe and sink is conducted with Icepak software, and the numerical results coincide well with the experiment ones, which show that the mathematical model is rather effective. The heat transfer performance of the flat-plate heat sink is also investigated by using numerical simulation methods and conducted by using the finite difference method, which is predigested as two-dimensional model. The numerical results are compared with the experimental ones.