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A Development Of The High Speed Instrument With DSP To Measure The Temperatures Of Many Dots Collaterally

Posted on:2003-09-18Degree:MasterType:Thesis
Country:ChinaCandidate:S N YaoFull Text:PDF
GTID:2132360065451350Subject:Materials science
Abstract/Summary:PDF Full Text Request
This paper discusses about the application of DSP in the high speed instrument to measure temperatures of many dots collaterally and the development of the high speed instrument with TMS320F240 to measure the temperatures of two dots collaterally.Firstly, it introduces the development and the present situation of the instruments to measure temperatures, brings up the necessity and practicability of development of the high speed instrument with DSP to measure the temperatures of many dots collaterally. And it also introduces the development of DSP, widespread applications on all area, the characters of DSP and how to development the application system of DSP.Secondly, it explains in detail why we choose TMS320F240, which is made by TI company, as the core chip of the instrument, and also explains why other chips are chosen. After considering the functions and the chips this instrument will achieve and use, we provide the simple frames of this system.Thirdly, it illustrates the process of the development of this system. It includes the designs of software, hardware and resisting interference, making the module and writing the programs.Lastly, h describes the difficulties met in debugging and ways to solve the problems. Moreover, it looks in the future of this instrument and brings up the parts to be improved in this system.
Keywords/Search Tags:DSP, High speed, Many dots, Measure temperatures collaterally
PDF Full Text Request
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