Research On Thermal Conductivity Of Particle Reinforced Aluminum Matrix Composites

As the excellent mechanical properties and thermal physical properties,partical reinforced aluminum matrix composites which also could be designed through process control have wide application prospect in the field of electronic packaging.Thermal conductivity of partical reinforced aluminum matrix composites is one of the important indicators of thermal physical prosperty,which is mainly sensitive to the factors of the size,shape,volume fraction of particle and the boundary of particle and matrix, so the rules which are not clear to date are studied and discussed by experiment and simulation in this paper.The experiment study shows that thermal conductivity of composites increases with the increment of particle size.The thermal conductivity of composites which are reinforced by different proportion of particle size rises with the increment of coarse particle.Thermal conductivity of composites decrease with increasing of thickness of layer of oxide ,while the decreasing range diminish with the augment of thickness,and the effect is prominent.Thermal conductivity of the composites with sphere particles are higher than that of the composites with square particles.The simulation study shows that thermal conductivity of particle reinforced aluminum matrix composites decreases with the growing of volume fraction of particles.Thermal conductivity of the composites varies slightly by increasing of particle size. Thermal conductivity of the composites with sphere particles are higher than that of the composites with square particles.With the increment of coarse particles,the thermal conductivity curve of composites have two points of extreme value. Thermal conductivity of composites decreases with the thickness of oxide layer,and the decrease range diminish with the augment of thickness, the effect is prominent. Thermal conductivity of composites with 1060 matrix are higher than that of composites with ZL101 matrix,and the difference between two matrix composites reduces with the increasing of volume fraction of particles.By contrasting the datas of experiment and simulation,the study shows that experimental values of the thermal conductivity of SiCp/Al composites get close to simulation values,so the simulation has certain reference value.The simulation values of Sip/Al composite are higher than experimental values.Under the condition of same effect factors,the experimental values of Sip/Al composite are all lower than that of SiCp/Al composite,but still meet electronic pakaging needs.