Research And Development Of The Fly Grabbing System Of Wire Bonder

With the development of the semiconductor manufacturing technology, it calls for high requirement for semiconductor packaging manufacturing, the invention and innovation of high-precision, high-efficiency and high-reliability wire bonder is an imperative requirement. A main factor constrains the wire bonder's efficiency is the low efficiency of the wire bonder's image-grabbing system, the main cause of the low efficiency of the static grabbing system is we should not grab images until the X-Y table stops, it will waste a long time to wait the work table stop steady. In order to solve this problem, a method is proposed in this dissertation which the images grabbed when the table is moving, it will avoid wasting time to wait for the X-Y table to stop, we analyze the problem faced in the wire bonder's fly-grabbing system, study the necessary indicators of the industrial camera and the motion control card used in the fly-grabbing system, find a general algorithm for fly-grabbing system, use software package MIL to process images grabbed by fly-grabbing system, and search a compensate law for the target points'position correction according to the results of image process and time-delay of image-grabbing. In this dissertation, through analysis of different trigger modes and time-delay of industrial camera in the moving state, we get the necessary indicators of the industrial camera and the motion control card, in order to make the points correction more easy and reliable, we find out a general path-planning algorithm for fly-grabbing system suits for different product, through the experiment, the accuracy of the general algorithm is verified, the work efficiency can be promoted and never lower the precision of the points position correction in the fly-grabbing system , the dissertation indicates that the fly-grabbing system applied in the wire bonder is feasible and effective.