The Research Of Automatic Soldering Equipment On Hsa Packing

With the importance of the unprecedented improvement and continuous development of the hard drive in microelectronic technology, the various performance indicators of the hard drive has been continuously improved. As an important component of the hard disk, The technology of the artificial soldering G-Pin/VC-Pin turn heads and soft circuit board in HSA production can not meet the requirements of efficiency in the hard disk production. An urgent need to transform and regenerate, and the urgent need for businesses to develop a new micro-welding problem to meet the HSA requirements of automated soldering equipment.The main thesis include:SMT discussed in detail the development of a comprehensive overview of laser technology and its classification and the subject of soldering techniques used in the selection of proposed development of HSA automatic brazing machine requirements.HSA is designed automatic soldering machine's overall program to study the JSBB technical principles and HSA automatic brazing machine motion positioning system consists of functional modules, visual alignment acquisition module, laser processing control module, user interaction four functional blocks. Carried out the structural design of the product prototype, discusses parametric design ideas in HSA automatic soldering machine in the use of CAD design engineering.The key parts of the soldering nozzle soldering and quality of the main factors affecting solder ball thermal analysis carried out, based on the soldering geometrical nonlinearity, material nonlinearity and deformation characteristics of non-linear analysis to determine the basic solution method; In this paper, the key to Processing part of welding nozzle for coupled thermo-mechanical analysis, using MARC software coupled thermo-mechanical analysis of a mathematical model calculations, boundary conditions, carried out analysis of heat conduction and thermal stress analysis.This thesis analyzes the impact of solder ball welding quality factors, through simulation and experiment to find the means to optimize the solder ball soldering method, and have been verified by experiment from the process to improve results, achieving the purpose of improving the welding effect.