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Study On Magnetron Sputtering Preparation And The Characteristics Of Ni-Ti Series Alloy Film

Posted on:2009-02-20Degree:MasterType:Thesis
Country:ChinaCandidate:L M WangFull Text:PDF
GTID:2121360272480413Subject:Materials science
Abstract/Summary:PDF Full Text Request
In this paper, DC magnetron sputtering in glass and silicon (100) deposited on the substrate Ni-Ti shape memory alloy film in the glass substrate were used to target single-and dual-target deposition of the Ni-Ti-Hf-Cu shape memory alloy film , A system of a film on the surface characteristics, organizational structure and martensitic transformation, and so on.The Ni-Ti shape memory alloy film testing and analysis showed that the film was part of the films in the Ti content higher than the target. X-ray diffraction analysis showed that the sputtering by the film are amorphous, after 4.0×10-4Pa, at 600℃insulation 1 h after the crystallization furnace cold treatment, precipitation in the single-crystal film Ni3Ti2 of the state in the next DSC tests found no obvious transformation point. Preparation of the alloy film morphology observed, results showed that the temperature on the matrix prepared by the influential film morphology.Preparation of the target of double-Ni-Ti-Hf-Cu shape memory alloy film on the surface morphology of observation, evaluation and establishment of quality evaluation model to determine the dual-target system of the best films. SEM observed in the Ni-Ti-Hf-Cu shape memory alloy film section of the morphology, and under the conditions of different parameters to compare the film thickness and found that the film thickness with the sputtering power or sputtering time increased, with the pressure of the Ar Did not change significantly. With the increase of sputtering power, the sputtering particles in the film increased faster film, the crystallization of treatment using atomic force microscope found that the surface roughness also increases. With the increase in Ar pressure, surface roughness, at first increased and then decreased trend. With the increase of sputtering power, the four elements in the film changes little with the increase of Ar pressure, Ni was the first decrease in more stable trend, other elements did not significantly change the content; With the sputtering Time of the film Ni content was gradually increasing trend, while Hf was the decreasing trend.Preparation of a magnetron sputtering of the Ni-Ti-Hf-Cu shape memory alloy film amorphous and crystallized after the main room temperature for martensitic, and observed that a small number of (Ti, Hf, Cu)2Ni of precipitation ; DSC results showed that Ms films about 230℃, phase change lags behind the 30℃, phase change lags behind narrow margin but a very small change.
Keywords/Search Tags:Shape memory alloys (SMA), magnetron sputtering, film, organizational structure, martensitic transformation
PDF Full Text Request
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