The Study Of Polyimide With Abrasive As A Kind Of Grinding Slice

With the rapid development of high technology in recent years, the high quality, precision and temperature-resistant mechanical planarization materials tend to be widely used and intensively studied. Polishing with abrasive films is one of the predominant methods for mechanical planarization, especially for hard and brittle materials including glass surface, ceramic components, optical lenses, semiconductor wafers, special metals and computer memory disks etc. Nowadays, more and more studies concentrate on the polishing techniques of abrasives. Whereas, there is little study involving the investigation of polyimide film with abrasive on the tribological properties.Polyimide(PI) is a very promising thermally stable polymer which has excellent properties such as innocuity, acid resistance, alkali resistance, cauterization resistance, strong mechanical strength, good heat resistance, high stability in vacuum, anti-radiation and solvent resistance etc. Based on these advantages, PI has been applied to automobile, spaceflight, printed circuits and other high-tech field. Nowadays, PI and its composites attract extensive concern and began to play the leading role in the area of tribological world-wide.The target of this work is to prepare a novel exact-material which is made of polyimide and abrasive. This new material can be used in the field of polishing such as metal, glass, jewelry, optical eyeglass, optical fiber etc. In this research, Al2O3/PI grinding slice and SiC/PI grinding slice have been prepared. The preparation process of the slice have been studied and their properties have been studied by using FT-IR, SEM, DSC-TGA, tension test. The conclusions obtained are: (1) FT-IR spectra of the grinding slice shows the physical bonds between abrasive and polyimide; (2)the section view of scanning electron microscope (SEM) shows the dual-layer structure of SiC/PI slice (the bottom-layer is a mixture composed of PI and uniformly spread abrasive, and the top-layer is pure PI); (3) mechanical properties test exhibits that the slice has excellent mechanical properties such as tensile strength is above 80 MPa and elongation at break is above 20% for both kinds of slices.(4)TGA data implys that the slice has the good thermal stability.(5)SEM image also shows good the results of a sheet copper surface polished by the slice.