Inspection Of Positioning And Moving Accuracy Of The Bonding Machine Of Planar Parallel Mechanism Based On Machine Vision

IC die bonder is a set of microelectronic packing equipment which is developed and manufactured by Faculty of Electromechanical Engineering of Guangdong University of Technology.To improve its picking speed and positioning accuracy as well as optimize the bonding machine of serial mechanism,now a planar parallel mechanism has already been designed.Therefore,the positioning and moving accuracy of the bonding machine of parallel mechanism must be inspected so that we can evaluate its performance parameters.This paper bases on the inspecting technology of the machine vision,constructs the experimental hardware platform and image processing software inspecting system for the inspection of positioning and moving accuracy and accomplishes the inspection by the measurement of the center coordinates of chipset which is fixed on the bonding machine.The paper mainly includes the following three aspects:1.Construct the experimental hardware platform for inspectionBecause the machine vision hardware devices are very important and will affect the precision of the measurement system,this paper first analyzes in details the influences of the image acquiring hardware including CCD camera,image acquisition board,light source and lens,then constructs experimental hardware platform according to the accuracy requirements;In view of the moving accuracy's inspection, the XY table has been established to drive the image acquiring devices moving in the key points place of the parallel machine plane.2.Develop image processing and XY table motion control system by LabVIEWThe paper combines the image processing and motion control software packages under LabVIEW 8.5 development environment for re-development.The image processing software is the core of the whole inspecting system,it introduces NI Corporation's IMAQ Vision8.5 software package which has provided the general image processing algorithm library;Through image acquiring and image preprocessing such as image calibration,enhancement,smoothness and so on,then separately using two object-localization methods which one is based on the pattern Parameters of XY Table单位(mm)·螺距·行程·扭矩·丝杆直径·电机型号·X轴(带镜complete the inspection of positioning accuracy and also carry on the comparison. The XY table motion control system introduces NI Corporation's Motion7.2 software package,it controls the XY table to drive the image acquiring devices to move and the XY table to drive the image acquiring devices to move and make line interpolation within the parallel machine plane as well as record positions of all the key points so that it can help the image processing software system to carry on the positioning accuracy inspections and finally complete inspection of moving accuracy.3.Analyze the positioning and moving accuracy by using the inspecting systemThe paper firstly carries on the error analysis of the experimental hardware platform and the parallel mechanism,next with the inspecting platform it inspects repeatedly the positioning and moving accuracy of key points,and then finally it controls position compensation of the driver journey and do the inspecting again.The experiment result proves that compensation of the driver journey is feasible.In conclusion,this experimental platform of inspection achieves the purpose of inspecting the performance of the parallel mechanism of the IC die bonder,and becomes a powerful tool for the performance improvement and optimization.